深圳群跃半导体有限公司

型号： 厂商： 批号： 封装：

型号	数量	厂商	批号	封装	更新时间	询价
W9812G6KH-6	86400	WINBOND	1506+	TSOP-54	18-07-05	询价
EDD2516AKTA-5C-E	88585	ELPIDA	07+	TSOP66	18-07-05	询价
K4B2G1646Q-BYK0	15825	SAMSUNG	14+	FBGA96	18-07-05	询价
MX25L6445EMI-10G	19688	MXIC	14+	SOP-16	18-07-05	询价
MAX11876AEWJ	60000	MAXIM	14+	BGA	18-07-05	询价
MT48LC16M16A2TG-75IT:D	23150	MICRON	13+	TSOP54	18-07-05	询价
H27UBG8T2CTR-BC	15840	SKhynix	1338+	TSOP-48	18-07-05	询价
MT29F16G08ABACAWP:C	75626	MICRON	14+	TSOP48	18-07-05	询价
MT46V32M16-6T	63510	MICRON	1249+	TSOP56	18-07-05	询价
MT29F2G08ABAFAH4:F	9850	MICRON	1204+	BGA63	18-07-05	询价
MT29F2G08ABBEAH4:E	15600	MICRON	14+	VFBGA63	18-07-05	询价
MT48LC16M16A2B4-7E:G	23695	MICRON	14+	BGA	18-07-05	询价
S29GL256P11TFI010	46852	SPANSION	2014+	TSSOP	18-07-05	询价
SSM2603CPZ-REEL7	69830	ADI	2014+	QFN	18-07-05	询价
GT30F122	23688	TOSHIBA	2014+	TO-220F	18-07-05	询价
PAD1000YFFR	88572	TI	2014+	BGA	18-07-05	询价
MT9M111C12STC	12800	MICRON	2014+	CLCC28	18-07-05	询价
MAX98300EWL+T	43250	MAXIM	2014+	WLP-9	18-07-05	询价
TL16C550CPFBRG4	68572	TI	2014+	TQFP48	18-07-05	询价
MX25L1006EMS-10G	35802	MXIC	2014+	SOP	18-07-05	询价
MAX14566EETA+T	38655	MAXIM	2014+	TDFN	18-07-05	询价
H5PS1G83JFR-S6C	37300	HYNIX	13+	BGA	18-07-05	询价
MT29F2G08ABAEAWP:E	39060	MICRON	1416+	TSOP-48	18-07-05	询价
MT41K256M16HA-125IT:E	31800	MICRON	2014+	FBGA	18-07-05	询价
S3C2410AL-26	23650	SAMSUNG	1330+	BGA272	18-07-05	询价
S3C2416XH-40	21600	SAMSUNG	1438+	BGA330	18-07-05	询价
S3C44B0X01L-ED80	128000	SAMSUNG	1220+	TQFP-160	18-07-05	询价
H5PS5162FFR-Y5C	21350	HYNIX	2013+	BGA	18-07-05	询价
K4T51163QJ-BCE7	118050	SAMSUNG	1340+	BGA	18-07-05	询价
K4T51163QJ-BCE6	38550	SAMSUNG	1342+	BGA	18-07-05	询价

3  /  3334  页

12 3 45678

跳转页